The appropriate encapsulating and potting material for electronic components and PCB

When picking the right potting compound, it is easy for an expert to note the concerns and make some material recommendations. An expert can also provide materials for testing and give information regarding the dielectric strength, thermal conductivity, and characteristics of the adhesive, among other things, when testing has been concluded.

Potting materials used in electrical requirement industries and electronics should cover the components or devices to ensure it is safe from the surroundings. After potting, the component is secured within the assembly, protected from moisture, and electrically insulated to help it perform the tasks it was created for.

Potting creates a shell surrounding your device where the compound, not potting material, is introduced. This can be done manually, or an automated dispensing equipment can be utilized.

Considerations for potting

When picking the right compound for your need, some questions must be answered first.

• What type of component or device needs to be potted? What is the out or cavity volume that needs to be filled? This helps determine the shot size.
• Is the device being potted a high-voltage component, a transformer, or an electronic part? Answering this question can tell you more about its characteristics. A potting compound may be a good choice for electronic parts but may not have the thermal conductivity or dielectric properties necessary for high-voltage applications.
• In what environment will the device be operated in? Will it be cold or hot? Will there be moisture exposure? Will there be chemicals or solvents? What about vibration?
• What is the gel time or curing time that is acceptable for the project or application? What kind of mechanism is needed for curing? Oven? Room temperature? UV?
• What are the characteristics demanded by the application? Flexible or durable hard bonding?
• What is the CTE of the compound? When there is coefficient of thermal expansion differences between the component and the compounds may lead to stress and sometimes fracturing of parts, especially the fragile ones.
• How do you intend to apply the compound? Manually or through an automated process? How many parts are needed every hour, and what shot size is needed?
• Do you want a material that is flame-retardant?
• What kind of hardness do you want the compound to have?
• What are the cost of the components and the compound? How much does the final product cost?

By considering the above examples, it becomes much easier to pick the best potting compound and the process to use. This is the only way to get your hands on the best potting compound that matches your needs.

Bottom line

Different potting compounds can be considered, with the popular ones being silicones, urethanes, unsaturated polyesters, and hot melts. All of these compounds have their pros and cons. Finding the best quality is the only way to ensure that your devices and components are not compromised.

At DeepMaterial, we have been making the best compounds that can be used for potting and encapsulating your devices and components. The best thing about working with us is the ease at which we can create custom-made solutions to meet very specific demands. We engage in research and development to develop the most superior products that can be used in many applications today.

For more about the appropriate encapsulating and potting material for electronic components and PCB,you can pay a visit to DeepMaterial at https://www.epoxyadhesiveglue.com/the-major-types-of-encapsulating-and-potting-compounds-for-pcb/ for more info.