Non Conductive Epoxy Resin Adhesive : The Ideal Solution for Electronics Applications Non-conductive epoxy resin is a crucial material in electronics applications. This type of epoxy resin has unique properties that make it an ideal solution for various electronic devices. In this article, we will explore the characteristics of non-conductive...
An Overview Of BGA Underfill Process And Non Conductive Via Fill Flip chip packaging exposes chips to mechanical stress because of extensive coefficient thermal expansion mismatch between the silicon chips and the substrate. When there is a high thermal load, the mismatch stresses the chips, thus making reliability a concern....
Potting electronics with silicone for better performance If you want your electronics to give you great performances and to last, you should use silicones for encapsulation and potting. There are more electronics all around us today than ever before. These electronics have become a part of our daily lives in...
